Empowering Progress in Microelectronics

Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework. We provide solutions for each stage of your journey – from R&D to industrial automated production.

Research & Development

Our R&D Bonders are ready to tackle the challenges of today and tomorrow. Flexible, accurate and retrofittable at all times.

Discover R&D Bonders

High Yield Production

Easy process transition from development into production for your ideas in series.

Discover Production Bonders

Advanced Rework

Made for all SMD rework challenges. For reworked components as reliable as new.

Discover Rework Equipment

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— Peter Patternman, Quality Tester at Finetech

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The Fastest FINEPLACER^® for Production

The automated FINEPLACER^® femto pro embodies the essence of the successful FINEPLACER^® femto die bonder platform, offering high precision and versatility with a focus on reduced cost-per-bond and higher UPH.

Innovation is more than just a buzzword for us. It is what drives us.

At Finetech, we have always developed technologies that not only reflect the state of the art but also help shape it. Whether modular systems, AI-based processes, or sustainable system architecture: our innovative strength is a strategic component of our identity.